tza3019 NXP Semiconductors, tza3019 Datasheet - Page 20

• Manufacturer Part Number: tza3019
• Description: 2.5 Gbits/s Dual Postamplifier With Level Detectors And 2 X 2 Switch
• Manufacturer: NXP Semiconductors

Philips Semiconductors
APPLICATION INFORMATION
RF input and output connections
Striplines, or microstrips, with an odd mode characteristic
impedance of Z
RF connections on the PCB. This applies to both the signal
inputs and the signal outputs. The two lines in each pair
should have the same length.
Grounding and power supply decoupling
The ground connection on the PCB needs to be a large
copper filled area connected to a common ground plane
with an inductance as low as possible.
2001 Jun 25
2.5 Gbits/s dual postamplifier with level
detectors and 2
o
= 50
have to be used for the differential
2 switch
20
To minimize low frequency switching noise in the vicinity of
the TZA3019, the power supply line should be filtered once
using a beaded capacitor circuit with a low cut-off
frequency.
The exposed die pad GNDp connection on the PCB also
needs to be a large copper area to improve heat transfer
to the PCB and thus support IC cooling (see Figs 13
and 14).
Product specification
TZA3019