tza3019 NXP Semiconductors, tza3019 Datasheet - Page 21

• Manufacturer Part Number: tza3019
• Description: 2.5 Gbits/s Dual Postamplifier With Level Detectors And 2 X 2 Switch
• Manufacturer: NXP Semiconductors

Philips Semiconductors
2001 Jun 25
handbook, full pagewidth
2.5 Gbits/s dual postamplifier with level
detectors and 2
In order to enable heat flow out of the package, the following measures have to be taken:
(1) Solder the 3
(2) Add a plane with minimum 200 mm
(3) Use maximum amount of vias to connect two planes.
(4) Use minimum of openings in heat transport area between hot plane and ground planes.
3 mm
2
To central
GND decoupling
To central
GND decoupling
die pad to a plane with maximum size.
0603
0
IN2Q
IN1Q
IN1
IN2
V CC1A
V CC1A
V CC2A
V CC2A
2 switch
0603
1
0603
2
in an inner layer, surrounded by ground layers.
Fig.13 PCB layout for positive supply voltage.
0603
Boundary of 200 mm
2
0603
0603
0603
0603
3
0603
4
0603
0603
0603
0603
2
area
5 mm
21
HTQFP
To central
GND decoupling
To central
GND decoupling
V CC1B
V CC1B
V CC2B
V CC2B
0603
0603
OUT1
OUT2
OUT1Q
OUT2Q
Product specification
TZA3019
MGS568