tza1032 NXP Semiconductors, tza1032 Datasheet - Page 19
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tza1032
Manufacturer Part Number
tza1032
Description
Laser Driver And Controller Circuit
Manufacturer
NXP Semiconductors
Datasheet
1.TZA1032.pdf
(24 pages)
Philips Semiconductors
11 BONDING PAD LOCATIONS
2002 May 06
V
V
V
V
TEST2
TEST1
TEST0
V
TEST_IN1
TEST_IN0
TEST_OUT1
TEST_OUT0
TEST_CLK
IRQ
OPC
I2C_A0
V
V
V
V
V
V
CLKN
CLKP
DATAP
DATAN
V
IVCON
IVREFCON
V
REFH
REFL
CFS
AMEAS
LASP
FSPLUS
AEZ
V
DD2
DD3
SSD3
SS
DDD3
DDD1
SSD1
SSA1
SSD4
DDD4
DDA1
DDA2
SSA2
DDD2
Laser driver and controller circuit
SYMBOL
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
1
2
3
4
5
6
7
8
9
+0.2665
+0.5155
+1.2595
+1.5085
+1.5085
+1.2595
+0.5155
+0.2665
+0.763
+1.012
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.012
+0.763
+0.019
1.2215
0.7265
0.4775
0.4775
0.7265
1.2215
1.469
0.974
0.230
0.019
0.230
0.974
COORDINATES
x
+0.2665
+0.5155
+1.2595
+1.5085
+0.763
+1.012
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
+1.758
1.2215
0.7265
0.4775
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.469
0.974
0.230
0.019
y
(1)
19
Note
1. All x and y coordinates represent the position of the
FSMIN
SCL
SDA
RDWR
ES
ES
FS
V
V
V
V
OUT1
OUT2
OUT3
DDA3
SSD2
SSA3
DD1
SYMBOL
centre of the pad in mm with respect to the centre of
the die (see Fig.5).
PAD
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Preliminary specification
1.469
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
1.758
COORDINATES
x
TZA1032
+1.5085
+1.2595
+0.5155
+0.2665
+1.758
+1.012
+0.763
+0.019
0.4775
0.7265
1.2215
0.230
0.974
1.469
y
(1)