msp430f2121irge Microchip Technology Inc., msp430f2121irge Datasheet - Page 45

• Manufacturer Part Number: msp430f2121irge
• Description: Msp430
• Manufacturer: Microchip Technology Inc.

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ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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http://www.ti.com/productcontent
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
The marketing status values are defined as follows:
MSP430F2131TDGVR
MSP430F2131TRGER
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
MSP430F2131TRGET
MSP430F2131IRGER
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
MSP430F2131IRGET
MSP430F2131TDWR
MSP430F2131TPWR
MSP430F2131TDGV
MSP430F2131IDWR
MSP430F2131IPWR
MSP430F2131TDW
MSP430F2131TPW
MSP430F2131IPW
Orderable Device
www.ti.com
Status
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
for the latest availability information and additional product content details.
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Package
TSSOP
TSSOP
TVSOP
TVSOP
TSSOP
TSSOP
VQFN
VQFN
VQFN
VQFN
SOIC
SOIC
SOIC
Type
Package
Drawing
RGE
RGE
DGV
DGV
RGE
RGE
DW
PW
PW
DW
DW
PW
PW
Addendum-Page 3
Pins Package
20
20
20
24
24
20
20
20
20
20
20
24
24
2000 Green (RoHS &
2000 Green (RoHS &
3000 Green (RoHS &
2000 Green (RoHS &
2000 Green (RoHS &
2000 Green (RoHS &
3000 Green (RoHS &
Qty
250
250
70
90
25
70
PACKAGE OPTION ADDENDUM
Green (RoHS &
Green (RoHS &
Green (RoHS &
Green (RoHS &
Green (RoHS &
Green (RoHS &
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
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Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
MSL Peak Temp
29-Jan-2009
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