sc68c752b NXP Semiconductors, sc68c752b Datasheet - Page 46

• Manufacturer Part Number: sc68c752b
• Description: 5 V, 3.3 V And 2.5 V Dual Uart, 5 Mbit/s Max. , With 64-byte Fifos And Motorola Up Interface
• Manufacturer: NXP Semiconductors

Philips Semiconductors
14. Abbreviations
SC68C752B_3
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 29:
Acronym
CPU
DMA
FIFO
LSB
MSB
UART
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Central Processing Unit
Direct Memory Access
First In/First Out
Least Significant Bit
Most Significant Bit
Universal Asynchronous Receiver and Transmitter
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
Rev. 03 — 29 November 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SC68C752B
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