hip0060 Intersil Corporation, hip0060 Datasheet - Page 2

• Manufacturer Part Number: hip0060
• Description: 1.5a, 50v Quad Low Side Power Driver With Serial Bus Control And Fault Protection
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Max Output Voltage, V
Max Output Load Current, I
Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Logic Supply Voltage, V
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . -40
Junction Temperature Range . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
OUTPUTS DRIVERS (DR0 TO DR7)
Output Channel Resistance
Over-Current Limiting Threshold
Output Clamping Voltage
Output Clamping Energy
Output OFF Leakage Current
Open-Load Fault Threshold
Output Rise Time
Output Fall Time
Turn-On Delay
Turn-Off Delay
POWER SUPPLY
Power On Reset Threshold
V
LOGIC INPUTS (INx, SI, SCK, RST, CS)
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis
High Output Voltage, SO, INT
Low Output Voltage, SO
Input Pull-Down Current, INx
Reset Input Pull-Up Current, RST
1.
2. The MOSFET Output Drain is internally clamped with a Drain-to-Gate zener diode that turns on the MOSFET; holding the Drain at the
3. The output drive is protected by an internal current limit. The I
4. Device dissipation is based on thermal resistance capability of the package in a normal operating environment. The junction to ambient
DD
Output Clamp voltage V OC .
imum current. The maximum current with all outputs ON may be further limited by dissipation.
thermal resistance of 60
of copper area as a heat sink, it is practical to achieve 35
achieved with additional PC Board Copper ground area or an external heat sink structure next to the ground leads at the center of the
package.
JA
Logic Supply Current
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
OUT
DD
. . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V
(Note 2) . . . . . . . . . . . . . . . . . . . . . V
LOAD
o
C/W is defined here as a PC Board mounted device with minimal copper. With approximately 2 square inches
(Per Output, Note 3) . . . . . . . . I
V
V
SYMBOL
DD
DD(POR)
V
r
R
I
DSON
I
V
E
t
V
ILHYS
V
INPD
t
OFF
I
V
RPU
I
I
V
OLD
ON
t
DD
CL
LK
t
OC
OC
= 4.5V to 5.5V, V
OH
R
OL
F
IH
IL
I
1ms Single Pulse Width, T
(Refer to Figure 3 for SOA Limits).
V
V
R
R
R
R
All Outputs ON or OFF
Current Sink = 1.6mA
Current Source = -0.8mA
OUT
OUT
OUT
L
L
L
L
= 30
= 30
= 30
= 30
= 0.5A
= 14.5V
= 14.5V, Output Off
o
o
C to 125
C to 150
SS
V
V
V
V
OUT
OUT
OUT
OUT
= 0V, T
CONDITIONS
o
HIP0060
C/W thermal resistance. Further reduction in the thermal resistance can be
OC
o
o
CL
CL
= 14.5V
= 14.5V
= 14.5V
= 14.5V
C
C
A
over-current limiting threshold parameter specification defines the max-
2
= -40
Thermal Information
Thermal Resistance (Typical, Notes 1, 4)
Maximum Storage Temperature Range -55
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
SOIC - PC Board Mount, Min. Copper . . . . . . . . . .
SOIC - PC Board Mount, 2 sq. in. Copper . . . . . . . .
(SOIC - Lead Tips Only)
A
o
C to 125
= 25
o
C,
o
C; Unless Otherwise Specified
0.7xV
V
DD
MIN
1.5
3.2
0.8
40
75
20
4
1
1
-
-
-
-
-
-
-
-
-0.8
DD
TYP
50
85
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
o
C to 150
0.2xV
MAX
180
200
250
120
0.8
3.5
4.4
0.4
60
12
12
12
12
10
-
-
-
-
DD
o
C
JA
UNITS
mA
mJ
k
(
60
35
A
V
V
V
V
V
V
V
o
A
A
A
s
s
s
s
C/W)
o
C