adsst-sharc-mel-100 Analog Devices, Inc., adsst-sharc-mel-100 Datasheet - Page 23

• Manufacturer Part Number: adsst-sharc-mel-100
• Description: Sharc Mel-100 Audio Processor
• Manufacturer: Analog Devices, Inc.

ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The SHARC Mel-100 is packaged in a 225-lead Mini Ball Grid
Array (MBGA). The SHARC Mel-100 is specified for a case
temperature (T
exceeded, a heat sink and/or an airflow source may be used. Use
the center block of ground pins (MBGA balls: F6–10, G6–10,
H6–10, J6–10, K6–10) to provide thermal pathways to the
printed circuit board’s ground plane. A heat sink should be
attached to the ground plane with a thermal adhesive as close as
possible to the thermal pathways.
where:
T
PD = Power dissipation in W (this value depends upon the
specific application; a method for calculating PD is shown in the
Power Dissipation section on page 21).
θ
CA
CASE
= Value from Table 7.
= Case temperature (measured on top surface of package)
T
CASE
= T
CASE
AMB
). To ensure that the T
+ ( PD × θ
CA
)
CASE
specification is not
Rev. 0 | Page 23 of 28
Table 7. Airflow over Package vs. θ
Airflow (Linear ft/min)
θ
25
CA
θ
JC
(°C/W)
= 6.8°C/W.
25
ADSST-SHARC-Mel-100
CA
0
17.9
200
15.2
400
13.7