hi-6110 Holt Integrated Circuits, Inc., hi-6110 Datasheet - Page 33

• Manufacturer Part Number: hi-6110
• Description: Bc / Rt / Mt Message Processor
• Manufacturer: Holt Integrated Circuits, Inc.

HEAT SINKING THE LEADLESS PLASTIC
CHIP CARRIER PACKAGE
The HI-6110PCI/T/M is packaged in a 64-pin plastic chip-
scale package (QFN). This package has a metal heat sink
pad on its bottom surface which
to the die.
left floating.
For optimum thermal dissipation the heat sink
soldered to a metalized pad on the printed circuit board.
R
edundant "vias" between the exposed board surface
Tx Data from
Manchester
Encoder
TXINHA/B
35
Point “A “
The heat sink may be connected to VDD or
W
(.5 Zo)
Tx Data from
Manchester
Encoder
TXINHA/B
D
TRANSMITTER
(.75 Zo)
(.75 Zo)
52.5
52.5
Figure 7. Transformer Coupled Test Circuits
TRANSMITTER
is electrically connected
W
W
35 W
Figure 6. Direct Coupled Test Circuits
BUSA/B
BUSA/B
Transformer
Coupling
HOLT INTEGRATED CIRCUITS
1.4:1
BUSA/B
BUSA/B
55 W
55 W
should be
Transformer
Isolation
Transformer
1:2.5
Isolation
Point
HI-6110
“A ”
2.5:1
T
Transformer
33
Transformer
Isolation
Isolation
1:2.5
2.5:1
and a buried VDD power plane will enhance thermal
conductivity.
DO NOT connect the heat sink pad to GND.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt MIL-STD-1553 data
communications devices. Layout considerations, as well
as recommended interface and protection components
are included.
Point
“A ”
T
Transformer
Coupling
1:1.4
55 W
55 W
RECEIVER
RECEIVER
35 W
(.75 Zo)
(.75 Zo)
52.5
52.5
W
W
Rx Data to
Manchester
Decoder
35
Point “A “
W
Rx Data to
Manchester
Decoder
(.5 Zo)
D