m35b32 STMicroelectronics, m35b32 Datasheet - Page 39

• Manufacturer Part Number: m35b32
• Description: 32 Kbit, 256-byte Page, Fast Program Eeprom Memory Accessed By Spi Bus Interface
• Manufacturer: STMicroelectronics

M35B32
Figure 24. Ultra thin Fine pitch Dual Flat Package No lead (UFDFPN8), 2 × 3mm
1. Drawing is not to scale.
1. The central pad (E2 × D2 area in the above illustration) is internally pulled to V
1. The circle in the top view of the package indicates the position of pin 1.
Table 14.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MC)
E2 (rev MC)
Symbol
be connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
ddd
A1
L1
L3
A
D
E
K
b
e
L
(2)
package outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
3.000
0.500
0.050
Typ
-
-
-
millimeters
0.450
0.200
1.900
1.200
2.900
0.300
0.300
0.300
Doc ID 18391 Rev 3
1.20
Min
0
-
-
-
0.600
0.050
0.300
2.100
1.600
3.100
0.500
0.150
Max
1.6
-
-
-
-
0.0217
0.0008
0.0098
0.0787
0.1181
0.0197
0.0020
Typ
-
-
-
-
Package mechanical data
SS
. It must not be allowed to
inches
0.0177
0.0079
0.0748
0.0472
0.1142
0.0472
0.0118
0.0118
0.0118
Min
0
-
-
(1)
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
0.0197
0.0059
Max
-
-
-
-
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