xc2234l-20f80l Infineon Technologies Corporation, xc2234l-20f80l Datasheet - Page 108

• Manufacturer Part Number: xc2234l-20f80l
• Description: Lim 16/32-bit Single-chip Microcontroller With 32-bit Performance Xc2000 Family / Econo Line
• Manufacturer: Infineon Technologies Corporation

PRELIMINARY
5
The XC2000 Family devices use the package type:
•
The following specifications must be regarded to ensure proper integration of the
XC223[04]L in its target environment.
5.1
These parameters specify the packaging rather than the silicon.
Table 38
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) without thermal vias; exposed pad not
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) without thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
4) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
Package Compatibility Considerations
The XC223[04]L is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
Data Sheet
soldered.
soldered.
soldered.
to the board.
PG-LQFP (Plastic Green - Low Profile Quad Flat Package)
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-64-22)
Symbol
Ex × Ey –
P
R
DISS
Θ JA
Min.
–
–
104
Limit Values
Max.
5.4 × 5.4
0.7
65
47
45
32
XC2000 Family / Econo Line
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via,
K/W No thermal via,
K/W 4-layer, no pad
K/W 4-layer, pad
XC2230L, XC2234L
–
2-layer
4-layer
V1.0, 2010-12
1)
2)
4)
3)