xc2234l-20f80l Infineon Technologies Corporation, xc2234l-20f80l Datasheet - Page 111

• Manufacturer Part Number: xc2234l-20f80l
• Description: Lim 16/32-bit Single-chip Microcontroller With 32-bit Performance Xc2000 Family / Econo Line
• Manufacturer: Infineon Technologies Corporation

PRELIMINARY
5.2
When operating the XC223[04]L in a system, the total heat generated in the chip must
be dissipated to the ambient environment to prevent overheating and the resulting
thermal damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(switching current and leakage current).
OH
+
) ×
P
IODYN
I
OH
) + Σ(
) ×
R
Θ JA
V
OL
×
I
OL
107
)
R
Θ JA
” quantifies these parameters. The
XC2000 Family / Econo Line
Package and Reliability
XC2230L, XC2234L
P
IODYN
V1.0, 2010-12
) depends