mx25l3255d Macronix International Co., mx25l3255d Datasheet - Page 3

• Manufacturer Part Number: mx25l3255d
• Description: Security Serial Flash
• Manufacturer: Macronix International Co.

POWER-ON STATE .................................................................................................................................. 26
ELECTRICAL SPECIFICATIONS ............................................................................................................. 27
Timing Analysis ....................................................................................................................................... 31
P/N: PM1431
(23) Read Security Register (RDSCUR) ................................................................................................................. 24
Table 6. Security Register Definition ....................................................................................................................... 25
(24) Write Security Register (WRSCUR) ................................................................................................................ 25
ABSOLUTE MAXIMUM RATINGS ......................................................................................................................... 27
Figure 2.Maximum Negative Overshoot Waveform ................................................................................................ 27
CAPACITANCE TA = 25°C, f = 1.0 MHz ................................................................................................................. 27
Figure 3. Maximum Positive Overshoot Waveform ................................................................................................. 27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL .................................................................. 28
Figure 5. OUTPUT LOADING ................................................................................................................................ 28
Table 7. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ....... 29
Table 8. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ....... 30
Figure 6. Serial Input Timing ................................................................................................................................... 31
Figure 7. Output Timing .......................................................................................................................................... 31
Figure 8. WP# Setup Timing and Hold Timing ....................................................................................................... 32
Figure 9. Write Enable (WREN) Sequence (Command 06) ................................................................................... 32
Figure 10. Write Disable (WRDI) Sequence (Command 04) .................................................................................. 32
Figure 11. Read Identification (RDID) Sequence (Command 9F) .......................................................................... 33
Figure 12. Read Status Register (RDSR) Sequence (Command 05) ..................................................................... 33
Figure 13. Block Write Lock Protection (BLOCKP) Sequence (Command E2) ..................................................... 33
Figure 14. Chip Unprotect (UNLOCK) Sequence (Command F3) ......................................................................... 34
Figure 15. Read Data Bytes (READ) Sequence (Command 03) ........................................................................... 34
Figure 16. Read Block Protection Lock Status (RDBLOCK) Sequence (Command FB) ....................................... 34
Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ....................................................... 35
Figure 18. 2 x I/O Read Mode Sequence (Command BB) ..................................................................................... 36
Figure 19. 4 x I/O Read Mode Sequence (Command EB) ..................................................................................... 36
Figure 20. 4 x I/O Read enhance performance Mode Sequence (Command EB) ................................................. 37
Figure 21. Page Program (PP) Sequence (Command 02) .................................................................................... 38
Figure 22. 4 x I/O Page Program (4PP) Sequence (Command 38) ...................................................................... 38
Figure 23. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 39
Figure 24. Sector Erase (SE) Sequence (Command 20) ...................................................................................... 39
Figure 25. Block Erase (BE) Sequence (Command D8) ....................................................................................... 39
Figure 26. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................... 40
Figure 27. Deep Power-down (DP) Sequence (Command B9) ............................................................................. 40
Figure 28. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB) .. 40
Figure 29. Release from Deep Power-down (RDP) Sequence (Command AB) .................................................... 41
Figure 30. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90 or EF or DF) .............. 41
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MX25L3255D
REV. 0.03, MAR. 13, 2009