emif04-ear01f2 STMicroelectronics, emif04-ear01f2 Datasheet - Page 5

• Manufacturer Part Number: emif04-ear01f2
• Description: 4-line Ipad, Emi Filter And Esd Protection
• Manufacturer: STMicroelectronics

EMIF04-EAR01F2
Figure 9.
Note:
Figure 7.
340 µm min for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Flip-Chip tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
Note: More information is available in the application note:
AN2348:"Flip-chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Copper pad Diameter
Footprint recommendations
All dimensions in mm
0.73 ± 0.05
Dot identifying Pin A1 location
User direction of unreeling
Figure 8.
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4 ± 0.1
1.56
(Y = year
ww = week)
4 ± 0.1
Marking
Ø 1.5 ± 0.1
Packaging information
x
y
w
x
w
E
z
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