MTB09N03H8 CYSTEKEC [Cystech Electonics Corp.], MTB09N03H8 Datasheet - Page 6

• Manufacturer Part Number: MTB09N03H8
• Description: N-Channel Logic Level Enhancement Mode Power MOSFET
• Manufacturer: CYSTEKEC [Cystech Electonics Corp.]

Power pak Dimension
Notes:
Material:
• Lead: pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB09N03H8
DIM
C
D
G
H
A
B
E
F
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
0.1890
0.2244
0.2323
0.0130
0.0354
0.0067
0.1445
Min.
0.0500*
Inches
0.1969
0.2283
0.2402
0.0201
0.0472
0.0118
0.1583
Max.
CYStech Electronics Corp.
4.80
5.70
5.90
0.33
0.90
0.17
3.67
Min.
Millimeters
1.27*
Max.
5.00
5.80
6.10
0.51
1.20
0.30
4.02
Device Name
Date Code
DIM
M
K
J
L
I
0.0161
0.1331
0.0433
0.0201
Min.
-
Marking:
8-Lead power pak Plastic Package
Inches
CYStek Package Code: H8
0.0240
0.1488
0.0280
Max.
-
-
CYStek Product Specification
Spec. No. : C709H8
Issued Date : 2009.05.07
Revised Date :
Page No. : 6/6
0.41
3.38
1.10
0.51
Min.
0°
Millimeters
*: Typical
Max.
0.61
3.78
0.71
12°
-