UPC1830GT NEC, UPC1830GT Datasheet - Page 42

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UPC1830GT

Manufacturer Part Number
UPC1830GT
Description
FILTER-CONTAINING VIDEO CHROMA/ SYNCHRONIZING SIGNAL PROCESSING LSI COMPATIBLE WITH NTSC/PAL SYSTEM
Manufacturer
NEC
Datasheet

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10. RECOMMENDED SOLDERING CONDITIONS
soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
(C10535E).
Surface Mount Device
Caution
42
PC1830GT: 42-pin plastic shrink SOP (375 mil)
Infrared ray reflow
Vapor phase soldering
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Process
Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Conditions
VP15-00-2
IR35-00-2
Symbol
PC1830

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