MT48H16M32LFCJ-75 MICRON [Micron Technology], MT48H16M32LFCJ-75 Datasheet - Page 72

• Manufacturer Part Number: MT48H16M32LFCJ-75
• Description: 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
• Manufacturer: MICRON [Micron Technology]

Package Dimensions
Figure 55:
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
Dimensions
apply to solder
balls post reflow.
Pre-reflow balls
are Ø0.42 on
Ø0.40 SMD ball
pads.
Seating
0.1 A
54X Ø0.45
6.4
plane
0.8 TYP
0.8 TYP
3.2
54-Ball VFBGA (10mm x 11.5mm)
A
Notes:
9
8
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
7
10 ±0.10
6.4
3.2
3
5 ±0.05
2
1
A
B
C
D
E
F
G
H
J
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Ball A1 ID
5.75 ±0.05
0.65 ±0.05
72
11.5 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID