PCA9525D NXP [NXP Semiconductors], PCA9525D Datasheet
PCA9525D
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PCA9525D Summary of contents
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PCA9525 Simple 2-wire bus buffer Rev. 1 — 25 February 2011 1. General description The PCA9525 is a monolithic CMOS integrated circuit for bus buffering in applications including I The buffer extends the bus load limit by buffering both the ...
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... Table 1. Ordering information Type number Topside Package mark Name PCA9525D PCA9525 SO8 PCA9525DP 9525 TSSOP8 5. Block diagram Fig 1. PCA9525 Product data sheet Description plastic small outline package; 8 leads; body width 3.9 mm plastic thin shrink small outline package; 8 leads; body width 5.5 V ...
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... PCA9525”. — supply pins SS All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 February 2011 PCA9525 Simple 2-wire bus buffer SCL_OUT PCA9525DP SCL_IN 002aaf331 Fig 3. Pin configuration for TSSOP8 © NXP B.V. 2011. All rights reserved. V ...
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NXP Semiconductors clocking when communicating with them. The buffer includes hysteresis to ensure clean switching signals are output, especially with slow rise times on high capacitively loaded buses. Output ports are open-drain type and require external pull-up resistors. 7.3 SDA_IN, ...
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NXP Semiconductors 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I/O P tot T stg T amb [1] Voltages are specified with respect to pin 4 (V ...
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NXP Semiconductors Table 4. Characteristics …continued − ° ° +85 C; voltages are specified with respect to ground (V amb Symbol Parameter Enable (EN) V enable threshold voltage th(en) V disable threshold voltage th(dis) V ...
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NXP Semiconductors ( lock °C T amb Fig 5. Typical input levels versus supply voltage 100 V OL (mV ...
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NXP Semiconductors This means that as direction control is handed from one side of the buffer to the other, a voltage ‘spike’ of about V became the ‘output’. Figure 9 the SDA_IN port, with direction ‘hand over’ spike (upper left ...
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NXP Semiconductors Figure 11 additional load capacitance if that is preferred), the rate of rise of both input and output can be matched, and the glitch on the rising edge eliminated. Fig 11. Matched ‘input’ and ‘output’ rise times 9.2 ...
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NXP Semiconductors 10. Application information 10.1 Design considerations Figure 13 excellent application to extending loads and providing interfaces to connectors on high speed microprocessor cards. PCA9525 can operate well in excess of the Fast-mode 400 kHz I the buffer with ...
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NXP Semiconductors BUS MASTER U3 Fig 14. PCA9525 typical buffer application Figure 15 one master may be used on the Sxx_IN side of the IC. However, to locate a master on the Sxx_OUT side and have that master be able ...
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NXP Semiconductors BUS MASTER U2 Fig 15. PCA9525 with masters on both sides of buffer Multiplexers such as the PCA9544A are simple analog switches which provide no capacitive load isolation between connected branches. enhancing an I branch. being an excellent ...
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NXP Semiconductors demultiplexer Fig 17. PCA9525 bus multiplexer application driven from a simple logic device SCL SDA Fig 18. PCA9525 bus multiplexer application driven from an I PCA9525 Product data sheet R1 1.8 kΩ SCL SDA ...
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NXP Semiconductors 11. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...
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NXP Semiconductors 12. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 13. Soldering of SMD packages ...
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NXP Semiconductors 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the ...
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NXP Semiconductors Fig 21. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 7. Acronym CMOS DDC 2 I C-bus I/O IC PMBus ...
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NXP Semiconductors 16. Revision history Table 8. Revision history Document ID Release date PCA9525 v.1 20110225 PCA9525 Product data sheet Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — ...
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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use neither qualified nor tested in accordance with automotive testing ...
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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...