MPC8270 MOTOROLA [Motorola, Inc], MPC8270 Datasheet - Page 42

• Manufacturer Part Number: MPC8270
• Description: PowerQUICC II Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
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Soldermask
1.27 mm Pitch
Polymide Tape
Figure 13. Pinout of the 480 TBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Glob-Top Dam
Glob-Top Filled Area
View
Die
Wire Bonds
Attach
Die
Copper Traces
Cavity
Etched
Pressure Sensitive
Adhesive
MOTOROLA
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