MPC8270 MOTOROLA [Motorola, Inc], MPC8270 Datasheet - Page 71

• Manufacturer Part Number: MPC8270
• Description: PowerQUICC II Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

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9
The following sections provide the package parameters and mechanical dimensions.
9.1
Package parameters are provided in Table 23.
MOTOROLA
Package
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Section 4.3, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can
leave the pin connected to GND with the noise filtering capacitors.
need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in
which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
VR
ZQ
ZU
Package Description
MPC8280
MPC8270
MPC8275VR
MPC8270VR
MPC8275ZQ
MPC8270ZQ
Package Parameters
Devices
MPC8280 PowerQUICC II™ Family Hardware Specifications
37.5 x 37.5
27 x 27
27 x 27
Outline
(mm)
Table 23. Package Parameters
PBGA
PBGA
TBGA
Type
Interconnects
480
516
516
Pitch
(mm)
1.27
1
1
Package Description
Nominal Unmounted
Height (mm)
1.55
2.25
2.25
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