ISL8200AM INTERSIL [Intersil Corporation], ISL8200AM Datasheet - Page 5

• Manufacturer Part Number: ISL8200AM
• Description: Complete Current Share 10A DC/DC Power Module
• Manufacturer: INTERSIL [Intersil Corporation]

Pin Descriptions
Typical Application Circuits
PIN #
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using vias. Connect this
PD2
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
PD4 V
23
GROUND
PVIN
DO NOT TIE EN DIRECTLY TO A POWER SOURCE
PV
OUT
IN
PIN NAME
Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
NC
SET R1 AND R2 SUCH THAT
0.8V ≤ VEN ≤ 5.0V
Not internal connected
pad to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE pin 16.
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN pin 17.
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND pin 18.
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT pin 19.
5
(Continued)
ISFETDRV1
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
PVIN
VIN
FF
EN
FSYNC_IN
CLKOUT
ISHARE_BUS
ISFETDRV
ISL8200AM
ISL8200AM
PIN DESCRIPTION
VOUT_SET
VSEN_REM-
PH_CNTRL
PGOOD
VOUT
VCC
VCC
PGOOD
RSET
2.2k
RSET CAN CHANGE VOUT
REFER TO TABLE 1
VOUT
September 13, 2012
GROUND
FN8271.2
VOUT