TPS851_07 TOSHIBA [Toshiba Semiconductor], TPS851_07 Datasheet - Page 4

• Manufacturer Part Number: TPS851_07
• Description: Silicon Epitaxial Planar
• Manufacturer: TOSHIBA [Toshiba Semiconductor]

Handling Precautions
is unstable and may change. Please take this into account.
At power-on in darkness, the internal circuit takes about 100 μs to stabilize. During this period the output signal
Moisture-Proof Packing
Mounting Precautions
Mounting Methods
(1)
(2)
(3)
(1)
(2)
(3)
(1)
To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Do not apply stress to the resin at high temperature.
The resin part is easily scratched, so avoid friction with hard materials.
When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Reflow soldering
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Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)
Package surface temperature: 260°C (max)
Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 60% RH or lower
Do not perform flow soldering.
Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Recommended baking conditions: 60°C for 12 h or longer
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
190°C
180°C
Preheating part
60 s to 120 s
Time (s) →
4
30 s to 50 s Heating part
260°C max
230°C
2007-10-01
TPS851