TPS851_07 TOSHIBA [Toshiba Semiconductor], TPS851_07 Datasheet - Page 5
TPS851_07
Manufacturer Part Number
TPS851_07
Description
Silicon Epitaxial Planar
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
1.TPS851_07.pdf
(12 pages)
Packing Specification
(2)
(3)
(1)
(2)
Recommended soldering pattern
Cleaning conditions
Packing quantity
Packing format
•
When cleaning is required after soldering
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Carton dimensions
Reel (minimum packing quantity)
(W) 81 mm × (L) 280 mm × (H) 280 mm
Carton
0.65
0.65
5
0.4
5 reels (15,000 devices)
Label
3,000 devices
Unit: mm
2007-10-01
TPS851