LPC1113 NXP [NXP Semiconductors], LPC1113 Datasheet - Page 3

• Manufacturer Part Number: LPC1113
• Description: 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash and 8 kB SRAM
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
4. Ordering information
Table 1.
LPC1111_12_13_14
Product data sheet
Type number
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/301
LPC1113FHN33/302
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
LPC1113FBD48/301
LPC1113FBD48/302
LPC1114FBD48/301
LPC1114FBD48/302
Ordering information
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 22 June 2011
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
© NXP B.V. 2011. All rights reserved.
Version
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SOT313-2
SOT313-2
SOT313-2
SOT313-2
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