DSPIC30F6012 MICROCHIP [Microchip Technology], DSPIC30F6012 Datasheet - Page 214

• Manufacturer Part Number: DSPIC30F6012
• Description: High-Performance, 16-Bit Digital Signal Controllers
• Manufacturer: MICROCHIP [Microchip Technology]

dsPIC30F6011/6012/6013/6014
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70117F-page 212
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-066
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
See ASME Y14.5M
p
c
Dimension Limits
#leads = n1
E1
E
Units
(F)
A2
A1
E1
D1
n1
A
E
D
B
n
p
L
c
MIN
n
.037
.002
.018
.004
.012
11
11
0
2
1
.630 BSC
.630 BSC
.551 BSC
.551 BSC
.039 REF
.031 BSC
INCHES
D1
L
NOM
64
16
D
.039
.024
.015
3.5
12
12
A
A1
MAX
.047
.041
.006
.030
.008
.018
(F)
13
13
7
MIN
0.95
0.05
0.45
0.09
0.30
11
11
0
MILLIMETERS*
© 2006 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
Revised 7-20-06
0.80 BSC
NOM
64
16
1.00
0.60
0.37
3.5
12
12
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7