DSPIC30F6012 MICROCHIP [Microchip Technology], DSPIC30F6012 Datasheet - Page 215

• Manufacturer Part Number: DSPIC30F6012
• Description: High-Performance, 16-Bit Digital Signal Controllers
• Manufacturer: MICROCHIP [Microchip Technology]

80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-116
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
c
Dimension Limits
#leads = n1
E1
E
Units
dsPIC30F6011/6012/6013/6014
A2
D1
n1
E1
A1
n
p
A
L
F
E
D
c
B
n
MIN
.037
.002
.018
.004
.011
11°
11°
2
1
0°
L
D1
INCHES
.039 REF.
.630 BSC
.630 BSC
.551 BSC
.551 BSC
A
NOM
A1
D
.026
.039
.024
.013
3.5°
12°
12°
80
20
MAX
(F)
.047
.041
.006
.030
.008
.015
13°
13°
7°
MIN
0.95
0.05
0.45
0.09
0.27
11°
11°
0°
MILLIMETERS*
Revised 7-20-06
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF.
NOM
0.65
1.00
0.60
0.32
3.5°
12°
12°
80
20
DS70117F-page 213
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.37
13°
13°
7°