LPC1776 NXP [NXP Semiconductors], LPC1776 Datasheet - Page 110
LPC1776
Manufacturer Part Number
LPC1776
Description
32-bit ARM Cortex-M3 microcontroller
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.LPC1776.pdf
(117 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1776FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Company:
Part Number:
LPC1776FET180
Manufacturer:
NXP
Quantity:
1 000
NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 47. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
sot570-2_fr
SOT570-2
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