MC9S12E128 MOTOROLA [Motorola, Inc], MC9S12E128 Datasheet - Page 109

• Manufacturer Part Number: MC9S12E128
• Description: MC9S12E-Family Device User Guide V01.04
• Manufacturer: MOTOROLA [Motorola, Inc]

A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
Two cases with internal voltage regulator enabled and disabled must be considered:
T J
T A
P D
Θ JA
P INT
NOTE:
I/O, Regulator and Analog Supply Voltage
Internal Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
Operating Junction Temperature Range
=
=
NOTES:
=
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper opera-
=
Junction Temperature, [°C ]
given operating range applies when this regulator is disabled and the device is powered from an external source.
tion.
Ambient Temperature, [°C ]
=
Total Chip Power Dissipation, [W]
Package Thermal Resistance, [°C/W]
Chip Internal Power Dissipation, [W]
Instead of specifying ambient temperature all parameters are specified for the more
meaningful silicon junction temperature. For power dissipation calculations refer
to Section A.1.8 Power Dissipation and Thermal Characteristics.
2
(1)
Rating
1
Freescale Semiconductor, Inc.
For More Information On This Product,
Table A-4 Operating Conditions
T J
Go to: www.freescale.com
P D
=
T A
=
P INT
+
Symbol
V
∆
∆
V
(
DDPLL
V
VDDX
VSSX
f
f
P D Θ JA
osc
bus
T
DD5
DD
J
+
•
P IO
Device User Guide — 9S12E128DGV1/D V01.04
3.135
Min
2.35
2.35
0.25
-0.1
-0.1
-40
0.5
)
3.3/5
Typ
2.5
2.5
0
0
-
-
-
Max
2.75
2.75
140
5.5
0.1
0.1
16
25
J
) in °C can be
Unit
MHz
MHz
°C
V
V
V
V
V
109