K4H510438G SAMSUNG [Samsung semiconductor], K4H510438G Datasheet - Page 17

• Manufacturer Part Number: K4H510438G
• Description: 512Mb G-die DDR SDRAM Specification
• Manufacturer: SAMSUNG [Samsung semiconductor]

K4H510438G
K4H510838G
K4H511638G
The following specification parameters are required in systems using DDR333, DDR266 & DDR400 devices to ensure proper system
performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
20.0 System Characteristics for DDR SDRAM
PARAMETER
DQ/DM/DQS input slew rate measured between
V
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
IH
Slew Rate Characteristic
Slew Rate Characteristic
(DC), V
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
IL
(DC) and V
AC CHARACTERISTICS
AC CHARACTERISTICS
IL
(DC), V
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
IH
Typical Range
Typical Range
(DC)
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
MIN
0.67
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
1.5
MIN
(V/ns)
(V/ns)
17 of 24
0.5
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
MIN
0.67
MAX
4.0
k
k
k
i
i
i
j
j
j
DDR333
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
1.5
MIN
0.5
DDR333
0.67
MIN
MAX
4.0
DDR266
Rev. 1.1 November 2009
MAX
1.5
MIN
0.5
DDR266
DDR SDRAM
MAX
4.0
Notes
e, l
Units
V/ns
Notes
a, l