K9F1G08Q0M-PIB0 SAMSUNG [Samsung semiconductor], K9F1G08Q0M-PIB0 Datasheet - Page 5
K9F1G08Q0M-PIB0
Manufacturer Part Number
K9F1G08Q0M-PIB0
Description
1Gb Gb 1.8V NAND Flash Errata
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.K9F1G08Q0M-PIB0.pdf
(38 pages)
- Current page: 5 of 38
- Download datasheet (715Kb)
PIN CONFIGURATION (TSOP1)
K9F1G08Q0M-YCB0,YIB0,PCB0,PIB0 K9F1G16Q0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-YCB0,YIB0,PCB0,PIB0 K9F1G16U0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-VCB0,VIB0,FCB0,FIB0
PACKAGE DIMENSIONS
48-PIN LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
0~8
48 - TSOP1 - 1220F
0.018~0.030
0.45~0.75
¡Æ
#1
#24
X16
CLE
ALE
N.C
N.C
N.C
N.C
N.C
N.C
R/B
N.C
N.C
Vcc
Vss
N.C
N.C
N.C
N.C
N.C
N.C
N.C
WE
WP
RE
CE
CLE
ALE
X8
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
R/B
Vcc
Vss
WE
WP
RE
CE
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
K9F1GXXX0M-YCB0,PCB0/YIB0,PIB0
0.787
20.00
0.724
18.40
0.008
0.20
0.004
Standard Type
12mm x 20mm
0.10
48-pin TSOP1
4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
#48
#25
(
0.020
0.50
X8
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
N.C
N.C
PRE
Vcc
Vss
N.C
N.C
N.C
I/O3
I/O2
I/O1
I/O0
N.C
N.C
N.C
N.C
)
X16
FLASH MEMORY
Vss
I/O15
I/O7
I/O14
I/O6
I/O13
I/O5
I/O12
I/O4
N.C
PRE
Vcc
N.C
N.C
N.C
I/O11
I/O3
I/O10
I/O2
I/O9
I/O1
I/O8
I/O0
Vss
0.039
1.00
0.047
1.20
0.05
0.002
MAX
SAMSUNG
Unit :mm/Inch
0.002
0.05
MIN
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