MF1ICS2005 NXP [NXP Semiconductors], MF1ICS2005 Datasheet - Page 4

• Manufacturer Part Number: MF1ICS2005
• Description: Sawn bumped 120?m wafer addendum
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
6. Chip orientation and bond pad locations
141130
Product data sheet
Fig 1. Chip orientation and bond pad locations
(4) Chip step, y -length:
(1) X - Scribeline width:
(2) Y- Scribeline width:
(3) Chip step, x -length:
(1)
(2)
(6)
1.11 mm
1.06 mm
Y
80 µm
80 µm
(5)
LA
VSS
Rev. 3.0 — 18 July 2007
TESTIO
MF1ICS2005
(3)
(5) LA bump edge to chip edge, y-length:
(6) LA bump edge to chip edge, x-length:
(7) LB bump edge to chip edge, y-length:
(8) LB bump edge to chip edge, x-length:
LB
(7)
(8)
Sawn bumped 120µm wafer addendum
PAD (center) x [µm]
TESTIO
LA
LB
VSS
MF1 IC S20 05
252.2
712.4
17.4
106.5 µm
103.0 µm
133.4 µm
88.6 µm
0.0
© NXP B.V. 2007. All rights reserved.
(4)
602.3
596.1
y [µm]
0.0
0.0
X
4 of 7