EMIF04-10006XF STMICROELECTRONICS [STMicroelectronics], EMIF04-10006XF Datasheet - Page 5

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EMIF04-10006XF

Manufacturer Part Number
EMIF04-10006XF
Description
4 LINES EMI ILTER AND ESD PROTECTION
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Figure 11: Order code
Figure 12: FLIP-CHIP Package Mechanical Data
Figure 13: Foot print recommendations
340µm min for 300µm copper pad diameter
Solder mask opening recommendation :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Copper pad Diameter :
500µm ± 50
250µm ± 50
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
2.92mm ± 50µm
315µm ± 50
EMIF
Figure 14: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
All dimensions in µm
(y = year
ww = week)
yy
-
xxx zz
545
650µm ± 65
Fx
x
y
EMIF04-10006F2
400
w
x
E
w
z
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