MT47H64M16HR-25E AIT:H Micron, MT47H64M16HR-25E AIT:H Datasheet - Page 18

• Manufacturer Part Number: MT47H64M16HR-25E AIT:H
• Description: Ic Ddr2 Sdram 1gbit 84fbga
• Manufacturer: Micron

Figure 8: 60-Ball FBGA (8mm x 10mm) – x8
PDF: 09005aef840eff89
1gbddr2_ait_aat.pdf – Rev. C 7/11 EN
10 ±0.1
60X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
8 CTR
0.8 TYP
0.155
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball composition: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62%
8
Nonconductive
Sn, 36% Pb, 2% Ag).
7
overmold
1.8 CTR
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
K
L
A
J
18
A
Ball A1 ID
1Gb: x8, x16 Automotive DDR2 SDRAM
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
0.25 MIN
1.1 ±0.1
2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging