MT46H32M16LFBF-6 L IT:B Micron, MT46H32M16LFBF-6 L IT:B Datasheet - Page 16
![no-image](/images/no-image-200.jpg)
MT46H32M16LFBF-6 L IT:B
Manufacturer Part Number
MT46H32M16LFBF-6 L IT:B
Description
Manufacturer
Micron
Datasheet
1.MT46H32M16LFBF-6LITB.pdf
(98 pages)
- Current page: 16 of 98
- Download datasheet (4Mb)
Figure 7: 90-Ball VFBGA (10mm x 13mm)
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
5.6
Note:
A
9 8
1. All dimensions are in millimeters.
3.2
7
10 ±0.1
6.4
5 ±0.05
3 2
1
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
16
13 ±0.1
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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