SST30VR023-500-C-WH Silicon Storage Tech, SST30VR023-500-C-WH Datasheet - Page 12

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SST30VR023-500-C-WH

Manufacturer Part Number
SST30VR023-500-C-WH
Description
Manufacturer
Silicon Storage Tech
Datasheet
Data Sheet
PACKAGING DIAGRAMS
TABLE 9: R
©2003 Silicon Storage Technology, Inc.
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
Number
32-
SST P
02
03
04
05
Note:
LEAD
ACKAGE
T
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
HIN
0.70
0.50
although some dimensions may be more stringent.
EVISION
2002 Data Book
Added the 022 device as a 500 ns part
Added Revision History
2004 Data Book
S
C
MALL
Pin # 1 Identifier
ODE
H
: WH
O
ISTORY
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
UTLINE
12.50
12.30
14.20
13.80
P
ACKAGE
www.SuperFlash.com or www.sst.com
(TSOP) 8
http://store.iiic.cc/
Description
MM X
SST30VR021 / SST30VR022 / SST30VR023
12
8.10
7.90
14
max.
1.20
MM
DETAIL
1.05
0.95
1mm
0.15
0.05
BSC
0.27
0.17
0.50
0.70
0.50
0˚- 5˚
S71135-05-000
32-tsop-WH-7
Aug 2002
Aug 2003
Dec 2003
Feb 2002
Date
12/03

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