SST30VR023-500-C-WH Silicon Storage Tech, SST30VR023-500-C-WH Datasheet - Page 12
SST30VR023-500-C-WH
Manufacturer Part Number
SST30VR023-500-C-WH
Description
Manufacturer
Silicon Storage Tech
Datasheet
1.SST30VR023-500-C-WH.pdf
(12 pages)
Data Sheet
PACKAGING DIAGRAMS
TABLE 9: R
©2003 Silicon Storage Technology, Inc.
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
Number
32-
SST P
02
03
04
05
Note:
LEAD
ACKAGE
T
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
•
•
•
•
HIN
0.70
0.50
although some dimensions may be more stringent.
EVISION
2002 Data Book
Added the 022 device as a 500 ns part
Added Revision History
2004 Data Book
S
C
MALL
Pin # 1 Identifier
ODE
H
: WH
O
ISTORY
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
UTLINE
12.50
12.30
14.20
13.80
P
ACKAGE
www.SuperFlash.com or www.sst.com
(TSOP) 8
http://store.iiic.cc/
Description
MM X
SST30VR021 / SST30VR022 / SST30VR023
12
8.10
7.90
14
max.
1.20
MM
DETAIL
1.05
0.95
1mm
0.15
0.05
BSC
0.27
0.17
0.50
0.70
0.50
0˚- 5˚
S71135-05-000
32-tsop-WH-7
Aug 2002
Aug 2003
Dec 2003
Feb 2002
Date
12/03