SSTUH32866EC/G,557 NXP Semiconductors, SSTUH32866EC/G,557 Datasheet - Page 2
![IC BUFFER 1.8V 25BIT SOT536-1](/photos/7/6/70664/96-lfbga_sot536-1_pkg_sml.jpg)
SSTUH32866EC/G,557
Manufacturer Part Number
SSTUH32866EC/G,557
Description
IC BUFFER 1.8V 25BIT SOT536-1
Manufacturer
NXP Semiconductors
Datasheet
1.SSTUH32866ECG518.pdf
(28 pages)
Specifications of SSTUH32866EC/G,557
Logic Type
1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage
1.7 V ~ 1.9 V
Number Of Bits
25, 14
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Logic Family
SSTU
Logical Function
Registered Buffer
Number Of Elements
1
Number Of Inputs
25
Number Of Outputs
25
High Level Output Current
-12mA
Low Level Output Current
12mA
Package Type
LFBGA
Propagation Delay Time
3ns
Operating Supply Voltage (typ)
1.8V
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Clock-edge Trigger Type
Posit/Negat-Edge
Polarity
Non-Inverting
Technology
CMOS
Frequency (max)
450(Min)MHz
Mounting
Surface Mount
Pin Count
96
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935277966557
SSTUH32866EC/G
SSTUH32866EC/G
SSTUH32866EC/G
SSTUH32866EC/G
Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
T
9397 750 14199
Product data sheet
Type number
SSTUH32866EC/G
SSTUH32866EC
amb
= 0 C to +70 C.
Ordering information
Solder process
Pb-free (SnAgCu
solder ball compound)
SnPb solder ball
compound
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation
Available in 96-ball, 13.5 mm
DDR2 registered DIMMs desiring parity checking functionality
Stacked or planar high-DRAM count registered DIMMs
Package
Name
LFBGA96
LFBGA96
1.8 V high-drive DDR2 configurable registered buffer with parity
Rev. 01 — 13 May 2005
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
5.5 mm, 0.8 mm ball pitch LFBGA package
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUH32866
Version
SOT536-1
SOT536-1
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