MAX11624EEG+T Maxim Integrated, MAX11624EEG+T Datasheet - Page 2

• Manufacturer Part Number: MAX11624EEG+T
• Description: Analog to Digital Converters - ADC 10-Bit 16Ch 300ksps 5V Precision ADC
• Manufacturer: Maxim Integrated

Specifications of MAX11624EEG+T

• Rohs: yes
• Number Of Channels: 16
• Architecture: SAR
• Conversion Rate: 300 KSPs
• Resolution: 10 bit
• Input Type: Single-Ended
• Interface Type: 3-Wire (SPI, Microwire), QSPI
• Operating Supply Voltage: 4.75 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 762 mW
• Minimum Operating Temperature: - 40 C
• Number Of Converters: 1
• Voltage Reference: 4.096 V

ABSOLUTE MAXIMUM RATINGS
V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (V
AIN0–AIN14, CNVST/AIN_,
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (T
10-Bit, 300ksps ADCs
with FIFO and Internal Reference
ELECTRICAL CHARACTERISTICS
(V
f
(MAX11618/MAX11620/MAX11624), T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
16 QSOP
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, f
2
Note 1: Package thermal resistances were obtained usiˇng the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SAMPLE
DC ACCURACY (Note 3)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Offset Error Temperature
Coefficient
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
DD
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
DD
REF to GND ...........................................-0.3V to (V
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= 2.7V to 3.6V (MAX11619/MAX11621/MAX11625); V
= 300kHz, f
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SCLK
= 4.8MHz (external clock, 50% duty cycle), V
A
= +70°C)
SYMBOL
A
SINAD
SFDR
= T
DNL
THD
RES
IMD
JC
INL
)......................37°C/W
MIN
JA
)...............105°C/W
to T
No missing codes over temperature
(Note 4)
Up to the 5th harmonic
f
-3dB point
S/(N + D) > 61dB
IN1
MAX
DD
DD
= 29.9kHz, f
, unless otherwise noted. Typical values are at T
+ 0.3V)
+ 0.3V)
CONDITIONS
IN2
SCLK
DD
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
24 QSOP
= 30.1kHz
REF
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
= 4.75V to 5.25V (MAX11618/MAX11620/MAX11624),
= 4.8MHz)
= 2.5V (MAX11619//MAX11621/MAX11625); V
MIN
10
A
= +25°C.) (Note 2)
±0.5
±0.5
±0.8
±0.1
TYP
100
-79
-81
-74
±2
62
1
JC
).......................34°C/W
JA
)................88°C/W
MAX
±1.0
±1.0
±2.0
±2.0
REF
= 4.096V
ppm/°C
ppm/°C
UNITS
MHz
Bits
LSB
LSB
LSB
LSB
FSR
LSB
dBc
dBc
dBc
kHz
dB