LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 99

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LPC1112FHN24/2021

Manufacturer Part Number
LPC1112FHN24/2021
Description
ARM Microcontrollers - MCU
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN24/2021

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
2 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Package / Case
HVQFN-24
Mounting Style
SMD/SMT
Factory Pack Quantity
2450
NXP Semiconductors
Fig 56. Package outline SOT313-2 (LQFP48)
LPC111X
Product data sheet
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT313-2
max.
1.6
48
A
37
y
0.20
0.05
36
A
1
1
e
1.45
1.35
A
2
136E05
IEC
pin 1 index
b
0.25
A
p
3
H
D
D
0.27
0.17
b
w
p
M
0.18
0.12
c
X
All information provided in this document is subject to legal disclaimers.
MS-026
JEDEC
Z D
12
25
D
7.1
6.9
(1)
REFERENCES
B
Rev. 8 — 20 February 2013
24
13
E
7.1
6.9
0
(1)
Z E
b
0.5
e
e
w
p
M
JEITA
v
v
scale
2.5
9.15
8.85
H
M
M
D
A
B
A
E
9.15
8.85
H
H
E
LPC1110/11/12/13/14/15
E
5 mm
L
1
0.75
0.45
L
A
32-bit ARM Cortex-M0 microcontroller
p
A
2
0.2
v
A
1
0.12
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
0.95
0.55
D
L
(1)
L
p
© NXP B.V. 2013. All rights reserved.
Z
0.95
0.55
E
(1)
ISSUE DATE
(A )
00-01-19
03-02-25
3
7
0
θ
SOT313-2
o
o
θ
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