MAX9240GTM+ Maxim Integrated, MAX9240GTM+ Datasheet - Page 6

• Manufacturer Part Number: MAX9240GTM+
• Description: Serializers & Deserializers - Serdes 28Bit GMSL Deserializer
• Manufacturer: Maxim Integrated

Specifications of MAX9240GTM+

• Rohs: yes

ABSOLUTE MAXIMUM RATINGS*
AVDD to EP ..........................................................-0.5V to +1.9V
DVDD to EP ..........................................................-0.5V to +1.9V
IOVDD to EP .........................................................-0.5V to +3.9V
IN+, IN- to EP .......................................................-0.5V to +1.9V
LMN_ TO EP (15mA current limit) ........................-0.5V to +3.9V
All other pins to EP .............................-0.5V to (V IOVDD + 0.5V)
IN+, IN- short circuit to ground or supply ................Continuous
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
DC ELECTRICAL CHARACTERISTICS
(V
+105°C, unless otherwise noted. Typical values are at V
Maxim Integrated
SINGLE-ENDED INPUTS (I2CSEL, LCCEN, GPI, PWDN, MS/HVEN)
High-Level Input Voltage
Low-Level Input Voltage
Input Current
THREE-LEVEL LOGIC INPUTS (CX/TP)
High-Level Input Voltage
Low-Level Input Voltage
Mid-Level Input Current
Input Current
SINGLE-ENDED OUTPUTS (DOUT_, PCLKOUT)
High-Level Output Voltage
Low-Level Output Voltage
Junction-to-Ambient Thermal Resistance (B
AVDD
6.25MHz to 100MHz, 25-Bit GMSL Deserializer for
= V
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
DVDD
= 1.7V to 1.9V, V
Coax or STP Cable With Line Fault Detect
A
= +70°C)
IOVDD
SYMBOL
V
V
V
I
V
I
V
V
INM
I
OH1
IN1
OL1
IH1
IL1
IN
IH
IL
= 1.7V to 3.6V, R
JA
) ............25°C/W
(Note 3)
V
I
I
OUT
OUT
IN
= 0V to V
= -2mA
= 2mA
AVDD
L
= 100I Q1% (differential), EP connected to PCB ground, T
IOVDD
= V
CONDITIONS
DVDD
Junction Temperature .....................................................+150°C
Operating Temperature Range ........................ -40°C to +105°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
*EP is connected to PCB ground.
Junction-to-Case Thermal Resistance (B
TQFN (derate 40mW/°C above +70°C) ......................3200mW
DCS = 0
DCS = 1
DCS = 0
DCS = 1
= V
IOVDD
= 1.8V, T
A
= +25°C.)(Note 2)
V
V
V
V
0.65 x
IOVDD
IOVDD
IOVDD
-150
- 0.3
- 0.2
MIN
0.7 x
IOVDD
-10
-10
TYP
MAX9240
JC
) .....................1°C/W
V
V
0.35 x
IOVDD
0.3 x
IOVDD
+150
MAX
+20
+10
0.3
0.2
A
= -40°C to
UNITS
FA
FA
FA
V
V
V
V
V
V
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