UBA2017P/1,112 NXP Semiconductors, UBA2017P/1,112 Datasheet
UBA2017P/1,112
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UBA2017P/1,112 Summary of contents
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UBA2017/UBA2017A 600 V fluorescent lamp driver with linear dimming function Rev. 2 — 15 May 2012 1. General description The UBA2017/UBA2017A are high-voltage Integrated Circuits (IC) intended to drive fluorescent lamps with filaments such as Tube Lamps (TL) and Compact ...
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... NXP Semiconductors 3. Applications Intended for fluorescent lamp ballasts with either a UBA2017A dimmable or a UBA2017 fixed output for AC mains voltages up to 390 V. 4. Ordering information Table 1. Ordering information Type number Package Name UBA2017T/N1 SO16 UBA2017AT/N1 UBA2017P/N1 DIP16 UBA2017AP/N1 Table 2. Functional selection ...
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... NXP Semiconductors 5. Block diagram (1) Pin 10 is not connected in the UBA2017P/T. Fig 1. Block diagram UBA2017 UBA2017 Product data sheet UBA2017/UBA2017A 600 V fluorescent lamp driver with linear dimming function All information provided in this document is subject to legal disclaimers. Rev. 2 — 15 May 2012 DDD © NXP B.V. 2012. All rights reserved. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning SLHB 1 IFB 2 3 EOL VFB 4 5 IREF CIFB CPT 8 aaa-001477 UBA2017T: pin 10 is n.c. (not connected). UBA2017AT: pin 10 is input pin DIM. Fig 2. Pin configuration UBA2017T/UBA2017AT (SO16) 6.2 Pin description Table 3. Symbol Pin SLHB IFB EOL VFB ...
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... NXP Semiconductors 7. Functional description 7.1 Introduction The UBA2017/UBA2017A is an integrated circuit for electronically ballasted fluorescent lamps. It provides a half-bridge controller/driver with all the necessary functions for correct preheat, ignition and on-state operation of the lamp. Several protection mechanisms are incorporated to ensure the safe operation of the fluorescent lamp or a shutdown of the complete ballast under any abnormal operating conditions or lamp failure ...
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... NXP Semiconductors 7.2.1 VDD supply The UBA2017/UBA2017A is intended to be supplied by a start-up bleeder resistor connected between the bus voltage V half-bridge point at pin SHHB. The IC starts up when the voltage at pin VDD rises above start-up voltage V locks out (stops oscillating) when the voltage at pin VDD drops below stop voltage ...
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... NXP Semiconductors V SHHB Fig 5. 7.3 Fluorescent lamp control The IC incorporates all the regulation and control needed for the fluorescent lamp(s), such as filament preheat, ignition frequency sweep, lamp voltage limitation, lamp current control, dimming, end-of-life detection, overcurrent protection and hard switching limiting. ...
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... NXP Semiconductors reset OR disable GLHB AND (reset OR disable) Stop state GLHB low fast fault fault timeout AND (ignition attempts = 2) fault timeout Other definitions: enable = (V > V FFPRHT th(en)(FFPRHT) disable = NOT(enable) ignition detected = (V > V IFB th(lod)(IFB) Fig 6. State diagram UBA2017 Product data sheet ...
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... NXP Semiconductors 7.3.1 Reset When voltage on pin VDD is below the reset voltage V driver are LOW. All internal latches are reset. When voltage on pin VDD rises above V rst(VDD) 7.3.2 Standby In the STANDBY state, the low-side gate driver is on (GLHB is HIGH). The floating supply capacitor C Preheat state is entered ...
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... NXP Semiconductors (1) Lamp voltage when lamp is off (not ignited yet). (2) Lamp current when lamp is on. Fig 7. The preheat frequency can also be regulated via pin PH/EN. During preheat, the output voltage of pin PH/ connected to this pin sinks is compared to at pin CF with no fault condition present and the capacitor at that pin being charged minus ...
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... NXP Semiconductors If either saturation or overvoltage is triggered, it overrules the frequency sweep-down and hold the frequency at the border where the fault appeared and start the fault timer. When the fault time-out t ignition attempt, otherwise it enters the Stop state; see 7.3.6 Auto-restart The Auto-restart state is entered after a fault time-out in the Ignition state during the first ignition attempt ...
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... NXP Semiconductors DOUBLE SIDE RECTIFIER I lamp IFB R ext(IFB) R i(IFB) VDD I bias(DIM) DIM V reg(ref) DIM input is only present in the UBA2017A Fig 8. Lamp current control The output of the OTA is connected to pin CIFB. The external capacitor C charged and discharged according to the voltage on the OTA inputs and the ...
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... NXP Semiconductors However, the switching frequency can never go below f reached at f 7.3.7.2 Operation without lamp current control To operate the lamp without current control the lamp current sense, pin IFB must be connected to ground. The lamp now operates at the lowest frequency f Figure 7.3.8 Stop state When in the Stop state, the IC is off and all driver outputs are low ...
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... NXP Semiconductors The end-of-life overvoltage protection is only active during the Burn state and (for UBA2017A) if the voltage at pin DIM is above the overvoltage end-of-life enable voltage V en(oveol)(DIM) 7.5.3 Capacitive mode detection Under all normal operating conditions, the half-bridge switching frequency should be higher than the load resonance frequency ...
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HV high side GHHB switch SHHB I load SENSE low side GLHB switch GND zero voltage switching hard switching (due to small phase difference between V and i ) SHHB load hard switching (due to small amplitude ...
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... NXP Semiconductors 7.5.5 Coil saturation protection When the peak voltage on pin SLHB exceeds saturation threshold voltage V additional current I the Ignition state, the fault timer is started and a discharge current I pin CIFB during the next cycle to increase the switching frequency. In the Burn state, the IC will go to the Stop state if coil saturation is detected longer than ...
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... NXP Semiconductors If the fault that started the timer is no longer detected for a period longer than the fault release delay time t fault, the timer will start from zero. Faults which activate the fault timer are shown as SlowFault in The fault timer uses the same pin (CPT) to set the time with an external capacitor C as the preheat timer ...
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... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to signal ground (GND pin 15); current flow into the IC is positive. Symbol Parameter General R reference resistance on ref(IREF) pin IREF SR slew rate T ambient temperature ...
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... NXP Semiconductors 9. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-a) ambient 10. Characteristics Table 6. Characteristics °C; settings according to default setting amb unless otherwise specified. Symbol Parameter High voltage I leakage current leak Start-up V start-up voltage on pin VDD startup(VDD) V stop voltage on pin VDD ...
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... NXP Semiconductors Table 6. Characteristics …continued °C; settings according to default setting amb unless otherwise specified. Symbol Parameter f preheat switching frequency sw(ph) HB lamp ignition f /f high switching frequency to low sw(high) sw(low) switching frequency ratio V low switching frequency voltage on pin fsw(low)(CIFB) CIFB V lamp on detection threshold voltage on ...
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... NXP Semiconductors Table 6. Characteristics …continued °C; settings according to default setting amb unless otherwise specified. Symbol Parameter Dimming I bias current on pin DIM bias(DIM) R input resistance on pin DIM i(DIM) HB protection V saturation threshold voltage on pin th(sat)(SLHB) SLHB t saturation detection delay time d(det)sat ...
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... NXP Semiconductors Table 6. Characteristics …continued °C; settings according to default setting amb unless otherwise specified. Symbol Parameter t /t ratio between preheat time-out time and to(ph) to(fault) fault time-out time Temperature protection T overtemperature protection activation th(act)otp threshold temperature T overtemperature protection release th(rel)otp threshold temperature [1] Default setting ...
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... NXP Semiconductors 11. Application information 11.1 Connecting the application A 33 kΩ resistor must be connected between pin IREF and GND. The tolerance of this resistor adds to any current related tolerances of the IC, including f components can be connected to pin IREF. The tolerance and temperature dependency of the capacitor connected between pin CF and GND will add to the tolerance Small decoupling capacitor (about 100 pF) is recommended on pin IFB close to the IC ...
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... NXP Semiconductors 12. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 13. Revision history Table 8. Revision history Document ID UBA2017 v.2 UBA2017 v.1 UBA2017 Product data sheet 600 V fluorescent lamp driver with linear dimming function Release date Data sheet status 20120515 Product data sheet 20120330 Preliminary data sheet All information provided in this document is subject to legal disclaimers. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 16. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Half-bridge driver . . . . . . . . . . . . . . . . . . . . . . . 5 7.2.1 VDD supply 7.2.2 Low- and high-side drivers . . . . . . . . . . . . . . . . 6 7.2.3 Non-overlap . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 Fluorescent lamp control . . . . . . . . . . . . . . . . . 7 7.3.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.2 Standby ...