MCIMX6Q7CVT08AC Freescale Semiconductor, MCIMX6Q7CVT08AC Datasheet - Page 19

• Manufacturer Part Number: MCIMX6Q7CVT08AC
• Description: Processors - Application Specialized i.MX6Q
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX6Q7CVT08AC

• Rohs: yes
• Core: ARM Cortex A9
• Processor Series: i.MX6
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 800 MHz
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 105
• Mounting Style: SMD/SMT
• Package / Case: FCBGA
• Interface Type: I2C, I2S, UART, USB
• Memory Type: L1/L2 Cache, ROM, SRAM
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2

1
4.1.2
4.1.2.1
Freescale Semiconductor
1
2
3
4
5
LVDS I/O supply voltage
VDD_HIGH_IN supply voltage
USB VBUS
Input voltage on USB_OTG_DP, USB_OTG_DN,
USB_H1_DP, USB_H1_DN pins
Input/output voltage range
ESD damage immunity:
Storage temperature range
Junction to Ambient
Junction to Ambient
Junction to Board
Junction to Case (top)
• Human Body Model (HBM)
• Charge Device Model (CDM)
provides the FCPBGA package thermal resistance data.
OVDD is the I/O supply voltage.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-3 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified
package.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the
interface layer.
Thermal Parameter
Thermal Resistance
Parameter Description
FCPBGA Package Thermal Resistance
1,4
1
1
1,5
i.MX 6Dual/6Quad Applications Processors for Industrial Products, Rev. 2
Single-layer board (1s); natural convection
Four-layer board (2s2p); natural convection
Single-layer board (1s); air flow 200 ft/min
Four-layer board (2s2p); air flow 200 ft/min
Table 5. FCPBGA Package Thermal Resistance Data
Table 4. Absolute Maximum Ratings (continued)
Test Conditions
USB_H1_VBUS/USB_OTG_VBUS
Supplies denoted as I/O supply
—
—
USB_DP/USB_DN
VDD_HIGH_IN
T
Symbol
V
STORAGE
in
V
/V
esd
out
3
2
3
2
Symbol
R
R
R
R
R
R
JCtop
JMA
JMA
JA
JA
JB
Min
-0.3
-0.3
-0.3
-0.5
-40
—
—
—
No Lid
<0.1
31
22
24
18
12
Electrical Characteristics
OVDD
Value
2000
Max
5.25
3.63
500
150
2.8
3.6
1
+0.3
Lid
24
15
17
12
5
1
C/W
C/W
C/W
C/W
C/W
C/W
Unit
Unit
o
V
V
V
V
V
V
C
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