CY7C1357C-133AXC Cypress Semiconductor Corp, CY7C1357C-133AXC Datasheet - Page 31
![IC SRAM 9MBIT 133MHZ 100LQFP](/photos/6/76/67624/428-100-tqfp_14x20x1_4_sml.jpg)
CY7C1357C-133AXC
Manufacturer Part Number
CY7C1357C-133AXC
Description
IC SRAM 9MBIT 133MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet
1.CY7C1355C-133AXC.pdf
(32 pages)
Specifications of CY7C1357C-133AXC
Memory Size
9M (512K x 18)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
6.5 ns
Maximum Clock Frequency
133 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
250 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
2
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2123
CY7C1357C-133AXC
CY7C1357C-133AXC
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1357C-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
135
Company:
Part Number:
CY7C1357C-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Company:
Part Number:
CY7C1357C-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document History Page
Document Number: 38-05539 Rev. *H
Document Title: CY7C1355C/CY7C1357C 9-Mbit (256 K × 36 / 512 K × 18) Flow-through SRAM with NoBL™ Architecture
Document Number: 38-05539
REV.
*A
*B
*C
*D
*E
*G
*H
*F
**
ECN NO.
2896585
3032633
3210400
242032
332059
351895
377095
408298
501793
Issue Date
03/20/2010
09/17/2010
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
03/30/11
Change
Orig. of
RXU
RKF
VKN
NJY
NJY
NJY
PCI
PCI
PCI
New data sheet
Changed Boundary Scan Order to match the B rev of these devices
Removed description on Extest Output Bus Tri-state
Removed 117 MHz Speed Bin
Changed I
Changed I
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Modified V
Corrected I
or V
Changed Θ
6.13 °C/W
respectively
Changed Θ
°C/W
respectively
Changed Θ
°C/W respectively
Added lead-free information for 100-pin TQFP, 119 BGA and 165 FBGA
Packages
Updated Ordering Information Table
Changed from Preliminary to Final
Changed I
Updated Ordering Information Table
Modified test condition in note# 14 from V
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table
Changed three-state to tri-state
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
Switching Characteristics table.
Updated the Ordering Information table.
Removed obsolete parts from Ordering Information table. Updated package
diagram, data sheet template, and Sales, Solutions, and Legal Information
section.
Updated
Added
Minor edits and updated in new template.
Removed following pruned parts from ordering information table.
CY7C1355C-133BGC
CY7C1357C-100AXC
Updated package diagram spec 51-85050 to *D.
IN
≤ V
Acronyms
IL
Ordering Information
) in the Electrical Characteristic Table on Pg #18
DDZZ
SB1
SB2
TH
OL,
SB4
JA
JA
JA
, t
and Θ
and Θ
V
and Θ
and I
from 30 to 40 mA
TL
Test Condition from (V
OH
from 35 mA to 50 mA on Pg # 9
from 25 ns to 20 ns and t
and
test conditions
SB3
Jc
Jc
Jc
for FBGA Package from 27 and 6 °C/W to 16.8 and 3.0
for BGA Package from 25 and 6 °C/W to 34.1 and 14.0
Units of
for TQFP Package from 25 and 9 °C/W to 29.41 and
from 40 mA to 110 and 100 mA respectively
Description of Change
and added
Measure.
IN
CY7C1355C, CY7C1357C
≥ V
IH
TDOV
Ordering Code
DD
< V
– 0.3V or V
from 5 ns to 10 ns in TAP AC
DD
to V
DDQ
IH
IN
< V
Relative to GND
Definitions.
≤ 0.3V) to (V
DD
Page 31 of 32
IN
≥ V
IH
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