PSMN2R2-40BS,118 NXP Semiconductors, PSMN2R2-40BS,118 Datasheet - Page 5

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PSMN2R2-40BS,118

Manufacturer Part Number
PSMN2R2-40BS,118
Description
MOSFET Std N-chanMOSFET
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PSMN2R2-40BS,118

Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
100 A
Resistance Drain-source Rds (on)
2.2 mOhms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Package / Case
D2PAK
Minimum Operating Temperature
- 55 C
Power Dissipation
306 W
Factory Pack Quantity
800
NXP Semiconductors
6. Thermal characteristics
Table 6.
PSMN2R2-40BS
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Z
(K/W)
th (j-mb)
10
10
10
10
-1
-2
-3
-4
1
10
Transient thermal impedance from junction to mounting base as a function of pulse duration
-6
δ = 0.5
0.2
0.1
0.05
0.02
single shot
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
10
-5
10
-4
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 March 2012
10
Conditions
see
Minimum foot print; mounted in a
printed circuit board
-3
N-channel 40 V 2.2 mΩ standard level MOSFET in D2PAK
Figure 4
10
-2
10
-1
PSMN2R2-40BS
Min
-
-
P
1
t
Typ
0.25
50
p
T
© NXP B.V. 2012. All rights reserved.
t
p
(s)
003aad100
δ =
Max
0.5
-
T
t
p
t
10
Unit
K/W
K/W
5 of 15

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