PSMN005-30K /T3 NXP Semiconductors, PSMN005-30K /T3 Datasheet - Page 9

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PSMN005-30K /T3

Manufacturer Part Number
PSMN005-30K /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PSMN005-30K /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
20 A
Resistance Drain-source Rds (on)
0.0055 Ohms
Configuration
Single Quad Drain Triple Source
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SO-8
Fall Time
45 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
3.5 W
Rise Time
16 ns
Factory Pack Quantity
2500
Typical Turn-off Delay Time
65 ns
Part # Aliases
PSMN005-30K,518
NXP Semiconductors
7. Package outline
Fig 14. Package outline SOT96-1 (SO8)
PSMN005-30K
Product data sheet
SO8: plastic small outline package; 8 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT96-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
1
0.057
0.049
1.45
1.25
A
076E03
2
IEC
1
8
Z
pin 1 index
0.25
0.01
y
A
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
All information provided in this document is subject to legal disclaimers.
0.25
0.19
MS-012
JEDEC
c
b
REFERENCES
p
0.20
0.19
D
Rev. 2 — 22 December 2011
5.0
4.8
5
4
0
(1)
w
0.16
0.15
E
4.0
3.8
(2)
M
JEITA
scale
1.27
0.05
2.5
c
e
N-channel TrenchMOS SiliconMAX logic level FET
A
0.244
0.228
2
H
6.2
5.8
A
E
1
0.041
1.05
5 mm
L
H
0.039
0.016
E
E
1.0
0.4
detail X
L
p
0.028
0.024
L
L
0.7
0.6
Q
p
Q
PROJECTION
(A )
EUROPEAN
PSMN005-30K
0.25
0.01
3
A
v
θ
0.25
0.01
A
w
X
v
M
0.004
0.1
A
© NXP B.V. 2011. All rights reserved.
y
ISSUE DATE
99-12-27
03-02-18
0.028
0.012
Z
0.7
0.3
(1)
SOT96-1
8
0
θ
o
o
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