BUK9608-55B /T3 NXP Semiconductors, BUK9608-55B /T3 Datasheet - Page 5

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BUK9608-55B /T3

Manufacturer Part Number
BUK9608-55B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9608-55B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
15 V
Continuous Drain Current
110 A
Resistance Drain-source Rds (on)
0.007 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
86 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
203 W
Rise Time
123 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
131 ns
Part # Aliases
BUK9608-55B,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9608-55B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to ambient as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
−6
δ = 0.5
single shot
0.05
0.02
0.2
0.1
10
−5
Conditions
see
minimum footprint; mounted on a PCB
All information provided in this document is subject to legal disclaimers.
Figure 4
10
−4
Rev. 04 — 4 May 2010
10
−3
10
−2
N-channel TrenchMOS logic level FET
P
10
t
−1
p
T
t
p
BUK9608-55B
Min
-
-
(s)
δ =
03nn56
t
T
t
p
1
Typ
-
50
© NXP B.V. 2010. All rights reserved.
-
Max
0.74
Unit
K/W
K/W
5 of 14

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