SI1539DL-T1 Vishay/Siliconix, SI1539DL-T1 Datasheet - Page 10

• Manufacturer Part Number: SI1539DL-T1
• Description: MOSFET 30 0.63/0.45
• Manufacturer: Vishay/Siliconix

Specifications of SI1539DL-T1

• Product Category: MOSFET
• Transistor Polarity: N and P-Channel
• Drain-source Breakdown Voltage: +/- 30 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 0.63 A, 0.45 A
• Resistance Drain-source Rds (on): 0.48 Ohms, 0.94 Ohms
• Configuration: Dual
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-363-6
• Fall Time: 8 ns at N Channel, 8 ns at P Channel
• Minimum Operating Temperature: - 55 C
• Power Dissipation: 300 mW
• Rise Time: 8 ns at N Channel, 8 ns at P Channel
• Factory Pack Quantity: 3000
• Tradename: TrenchFET
• Typical Turn-off Delay Time: 8 ns at N Channel, 5 ns at P Channel

AN814
Vishay Siliconix
NOTE: Although they are intended for low-power applications,
devices in the 6-pin SC-70 will handle power dissipation in
excess of 0.2 W.
Testing
To aid comparison further, Figure 2 illustrates the dual-channel
SC-70 thermal performance on two different board sizes and
two different pad patterns. The results display the thermal
performance out to steady state. The measured steady state
values of Rθ
www.vishay.com
2
SC-70 (6-PIN)
LITTLE FOOT SC-70 (6-PIN)
1) Minimum recommended pad pattern (see
Figure 2) on the EVB of 0.5 inches x
0.6 inches.
2) Industry standard 1” square PCB with
maximum copper both sides.
Room Ambient 25 _C
P
P
P
D
D
D
+
+ 150
+ 312 mW
T
JA
J(max)
400
for the dual 6-pin SC-70 are as follows:
Rq
o
C * 25
o
JA
* T
C W
A
o
C
Elevated Ambient 60 _C
P
P
P
D
D
D
+
+ 150
+ 225 mW
T
518_C/W
413_C/W
J(max)
400
Rq
o
C * 60
o
JA
* T
C W
A
o
C
The results show that if the board area can be increased and
maximum copper traces are added, the thermal resistance
reduction is limited to 20%. This fact confirms that the power
dissipation is restricted with the package size and the Alloy 42
leadframe.
ASSOCIATED DOCUMENT
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET Copper
Leadframe Version, REcommended Pad Pattern and Thermal
Performance, AN815, (http://www.vishay.com/doc?71334).
FIGURE 2.
500
400
300
200
100
0
10
-5
10
-4
Comparison of Dual SC70-6 on EVB and 1”
Square FR4 PCB.
10
-3
10
-2
Time (Secs)
Dual EVB
10
-1
1” Square FR4 PCB
1
Document Number: 71237
10
100
12-Dec-03
1000