P9030-EVK IDT, P9030-EVK Datasheet - Page 3

• Manufacturer Part Number: P9030-EVK
• Description: Power Management IC Development Tools
• Manufacturer: IDT
• Type: PMIC Solutionsr

Specifications of P9030-EVK

• Product: Evaluation Kits
• Tool Is For Evaluation Of: P9030
• Input Voltage: 10 V to 20 V
• Output Voltage: 5 V
• Output Current: 1.5 A
• Part # Aliases: IDTP9030-EVK
• For Use With: P9030-0NTGI

ABSOLUTE MAXIMUM RATINGS
These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may
cause permanent damage to the device. Functional operation of the IDTP9030 at absolute maximum ratings is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect long-term reliability.
Table 1. Absolute Maximum Ratings Summary. All voltages are referred to ground, unless otherwise noted.
Table 2. Package Thermal Information
Note 1:
result in excessive die temperature, and the device will enter thermal shutdown.
Note 2:
Note 3:
Note 4:
(PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance.
Note 5:
PINS
BUCK5VT_IN, IN, REG_IN. THESE PINS MUST BE CONNECTED TOGETHER AT ALL TIMES.
BST
LDO2P5V, XTAL/CLK_IN, XTAL/CLK_OUT
AGND, DGND, PGND, REFGND
BUCK5VT_SNS, BUCK5VT, GPIO_0, GPIO_1, GPIO_2, GPIO_3, GPIO_4, GPIO_5, GPIO_6, HPF,
ISNS, LDO2P5V_IN, LDO5V, RESET, SCL, SDA, VOSNS
SYMBOL



T
T
T
T
Revision 1.0.1
JA
JC
JB
J
A
STG
LEAD
, LX, SW
5
The maximum power dissipation is P
This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions.
Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
If the voltage at VIN is less than 24V, limit the voltages on
For the NTG48 package, connecting the 4.1 mm X 4.1 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole
5
DESCRIPTION
Thermal Resistance Junction to Ambient (NTG48 - TQFN)
Thermal Resistance Junction to Case (NTG48 - TQFN)
Thermal Resistance Junction to Board (NTG48 - TQFN)
Junction Temperature
Ambient Operating Temperature
Storage Temperature
Lead Temperature (soldering, 10s)
D(MAX)
= (T
J(MAX)
- T
A
) / θ
JA
, LX, SW to V(VIN)+0.3V and the voltage on BST to V(VIN)+5V.
where T
J(MAX)
is 125°C. Exceeding the maximum allowable power dissipation will
3
© 2012 Integrated Device Technology, Inc.
-40 to +150
-55 to +150
MAXIMUM
-40 to +85
RATING
+300
30.8
14.6
0.75
-0.3 to +0.3
-0.3 to +5.5
-0.3 to 2.75
MAXIMUM
-0.3 to 24
-0.3 to 24
-0.3 to 29
RATING
IDTP9030
Product Datasheet
UNITS
C/W
C/W
C/W
C
C
C
C
UNITS
V
V
V
V
V
V