MT46H8M32LFB5-5 IT:H Micron Technology Inc, MT46H8M32LFB5-5 IT:H Datasheet - Page 89
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MT46H8M32LFB5-5 IT:H
Manufacturer Part Number
MT46H8M32LFB5-5 IT:H
Description
IC DDR SDRAM 256MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H16M16LFBF-5H.pdf
(96 pages)
Specifications of MT46H8M32LFB5-5 IT:H
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
256M (8Mx32)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Package / Case
90-VFBGA
Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
6.5/5ns
Maximum Clock Rate
200MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
180mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 49: Self Refresh Mode
Power-Down
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Command
Address
CKE
DQS
CK#
CK
DM
DQ
1,2
1
Notes:
t
IS
t
IS
t
NOP
RP
T0
Power-down is entered when CKE is registered LOW. If power-down occurs when all
banks are idle, this mode is referred to as precharge power-down; if power-down occurs
when there is a row active in any bank, this mode is referred to as active power-down.
Entering power-down deactivates all input and output buffers, including CK and CK#
and excluding CKE. Exiting power-down requires the device to be at the same voltage as
when it entered power-down and received a stable clock. Note that the power-down
duration is limited by the refresh requirements of the device.
When in power-down, CKE LOW must be maintained at the inputs of the device, while
all other input signals are “Don’t Care.” The power-down state is synchronously exited
when CKE is registered HIGH (in conjunction with a NOP or DESELECT command).
NOP or DESELECT commands must be maintained on the command bus until
satisfied. See Figure 51 (page 91) for a detailed illustration of power-down mode.
4
t
t
IH
IH
t
1. Clock must be stable, cycling within specifications by Ta0, before exiting self refresh mode.
2. CKE must remain LOW to remain in self refresh.
3. AR = AUTO REFRESH.
4. Device must be in the all banks idle state prior to entering self refresh mode.
5. Either a NOP or DESELECT command is required for
CH
t
CL
t
IS
AR
T1
3
Enter self refresh mode
t
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89
256Mb: x16, x32 Mobile LPDDR SDRAM
Ta0
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
t
CK
t
NOP
IS
t
XSR time with at least two clock pulses.
Ta1
Exit self refresh mode
t
XSR
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©2008 Micron Technology, Inc. All rights reserved.
5
t
IS
Valid
Valid
Tb0
Don’t Care
t
IH
Power-Down
t
XP is