PBSS303NX T/R NXP Semiconductors, PBSS303NX T/R Datasheet - Page 11

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PBSS303NX T/R

Manufacturer Part Number
PBSS303NX T/R
Description
Transistors Bipolar - BJT TRANS BISS TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PBSS303NX T/R

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
30 V
Collector- Emitter Voltage Vceo Max
30 V
Emitter- Base Voltage Vebo
5 V
Maximum Dc Collector Current
5.1 A
Gain Bandwidth Product Ft
130 MHz
Dc Collector/base Gain Hfe Min
300 at 0.5 A at 2 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
UPAK
Dc Current Gain Hfe Max
300 at 0.5 A at 2 V
Maximum Power Dissipation
2100 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
1000
Part # Aliases
PBSS303NX,115
NXP Semiconductors
11. Soldering
PBSS303NX_2
Product data sheet
Fig 16. Reflow soldering footprint SOT89 (SC-62)
Fig 17. Wave soldering footprint SOT89 (SC-62)
4.60
0.85
Not recommended for wave soldering
1.20
1.20
1.00
0.20
(3x)
1.50
3
Rev. 02 — 20 November 2009
6.60
2.40
0.70
5.30
3
3.70
1.90
1.20
3.95
4.75
2.25
2.00
2
1
2
0.50
30 V, 5.1 A NPN low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
preferred transport direction during soldering
1.20
1.70
4.85
Dimensions in mm
msa442
PBSS303NX
CEsat
solder lands
solder resist
occupied area
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
msa423
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