AT45DB642D-TU Atmel, AT45DB642D-TU Datasheet - Page 56
![IC FLASH 64MBIT 66MHZ 28TSOP](/photos/7/21/72191/313-28-tsop_sml.jpg)
AT45DB642D-TU
Manufacturer Part Number
AT45DB642D-TU
Description
IC FLASH 64MBIT 66MHZ 28TSOP
Manufacturer
Atmel
Datasheet
1.AT45DB642D-CU.pdf
(58 pages)
Specifications of AT45DB642D-TU
Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
64M (8192 pages x 1056 bytes)
Speed
66MHz
Interface
Parallel/Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSOP
Density
64Mb
Access Time (max)
6ns
Interface Type
Parallel/Serial-SPI
Boot Type
Not Required
Address Bus
1/8Bit
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP-I
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
8M
Supply Current
15mA
Mounting
Surface Mount
Pin Count
28
Data Bus Width
8 bit
Architecture
Sectored
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
15 mA
Mounting Style
SMD/SMT
Organization
256 KB x 32
Memory Configuration
8192 Pages X 1056 Bytes
Clock Frequency
66MHz
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT45DB642D-TU
Manufacturer:
MICRON
Quantity:
101
Company:
Part Number:
AT45DB642D-TU
Manufacturer:
ATMEL
Quantity:
9 396
Company:
Part Number:
AT45DB642D-TU
Manufacturer:
AT
Quantity:
5
Part Number:
AT45DB642D-TU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
29. Revision History
56
AT45DB642D
Revision Level – Release Date
A – September 2005
B – November 2005
C – March 2006
D – July 2006
E – August 2006
F – August 2006
G – August 2007
H – April 2008
I – February 2009
J – March 2009
K - April 2009
History
Initial release
Changed t
Changed t
Changed t
Changed t
Added text, in “Programming the Configuration Register”, to indicate
that power cycling is required to switch to “power of 2” page size
after the opcode has been executed.
Corrected typographical errors.
Added errata regarding Chip Erase.
Added t
Added additional text for “power of 2” binary page size option.
Changed t
Added t
Added part number ordering code details for suffixes SL954/955.
Added ordering code details.
Changed t
RapidS interface.
Changed Deep Power-Down Current values
Updated Absolute Maximum Ratings
Added 24C1 24 Ball BGA package Option
Deleted DataFlash Card Package Option
- Increased typical value from 9 µA to 15 µA.
- Increased maximum value from 18 µA to 25 µA.
SCKR
CLKR
VCSL
PUW
DIS
V
RDPD
DIS
from 8 ns to 6 ns max.
and t
and t
from 8 ns to 6 ns max.
(Typ and Max) to 27 ns and 35 ns, respectively, for
from 10 ms to 20 ms max.
from 30 µs to 50 µs min.
from 30 µs to 35 µs.
CLKF
SCKF
parameters to Table 18-5.
parameters to Table 18-4.
3542K–DFLASH–04/09