PCF8576CT/1,118 NXP Semiconductors, PCF8576CT/1,118 Datasheet - Page 49

• Manufacturer Part Number: PCF8576CT/1,118
• Description: IC LCD DVR UNVRSL LOW-MUX 56VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8576CT/1,118

• Package / Case: 56-VSOP
• Display Type: LCD
• Configuration: 40 Segment
• Interface: I²C
• Current - Supply: 120µA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 20
• Number Of Segments: 160
• Maximum Clock Frequency: 315 KHz
• Operating Supply Voltage: 2 V to 6 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 150 C
• Maximum Supply Current: 120 uA
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1080-2; 935278818118; PCF8576CTD-T

NXP Semiconductors
17. Soldering of SMD packages
PCF8576C
Product data sheet
17.1 Introduction to soldering
17.2 Wave and reflow soldering
Table 20.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Symbol
A
B
C
D
E
F
G
H
J
K
L
M
x
y
•
•
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Tray dimensions
All information provided in this document is subject to legal disclaimers.
Description
pocket pitch; x direction
pocket pitch; y direction
pocket width; x direction
pocket width; y direction
tray width; x direction
tray width; y direction
cut corner to pocket 1,1 center
cut corner to pocket 1,1 center
tray thickness
tray cross section
tray cross section
pocket depth
number of pockets; x direction
number of pockets; y direction
Rev. 10 — 22 July 2010
Universal LCD driver for low multiplex rates
PCF8576C
Value
5.59 mm
6.35 mm
3.22 mm
3.50 mm
50.67 mm
50.67 mm
3.94 mm
1.76 mm
2.46 mm
0.89 mm
8
7
5.78 mm
6.29 mm
© NXP B.V. 2010. All rights reserved.
49 of 57